LED chip manufacturing

LED chip manufacturing process can be generalized into Wafer processing (Wafer Fabrication), needle Wafer measuring process (Wafer Probe) process (Packaging), Packaging, testing process (Initial Test andFinal Test), etc. Several steps. The wafer processing and wafer needle test process for the Front (Front End) process, and construct process, testing process to segment (Back End) after operation.

1 Wafer processing

The main work of this process is making the circuit on the wafer and electronic components (such as transistors, capacitors, logical switch, etc.), the handler is often associated with products and the technology used, but the general basic steps is to wafer appropriate to clean first, again on the surface of oxidation and chemical vapor deposition, then coating, exposure, development and etching, ion implantation, metal sputtering step repeatedly, eventually completed several layers of circuit on the wafer and components processing and production.

2 Wafer needle test process

After the procedure, the wafer is formed on one small, namely grain, usually, to facilitate test, improve efficiency, on the same wafer production the same varieties, specifications of the products; But also can according to need to make several different varieties, specifications of the products. In needle (Probe) gauge its electrical properties for each grain size detection, and will not be qualified after grain label mark, wafer cutting, divided into each single grain and then classified according to their electrical properties, loading different tray, unqualified grain is abandoned.

3 Construct process

Is the will of a single grain is fixed on a bed of made of plastic or ceramic chip, and to guide on grain etching out some terminal connected to the base bottom out pins, as a circuit board connected with the outside world, the cover with plastic cover, the glue sealing. Its purpose is to protect the grain to avoid high temperature mechanical scratch or damage. Here is made from a piece of integrated circuit chips (which we can see in the computer the black or brown, or edges on both sides with many pins or rectangular pieces of lead).

4 Test process

Chips at the end of the procedure for testing, can be divided into the general and special testing, the former is to encapsulate the chip after testing its electrical properties under various environment, such as the consumed power, speed, pressure, etc. After testing the chips, according to its electric property is divided into different grades. And special test is according to customer special requirements of technical parameters, specifications, varieties from similar parameters in a portion of the chip, do targeted specialized testing, look to whether can meet the special needs of customers, to decide whether to be special chip design for the customer. The general test qualified product specification, type and date of sticker label and the factory after packaging. Did not pass the test of the chip to be achieved depending on the parameters of the hirer degradation products or waste.

LED chip manufacturing process:

Epitaxial wafer - cleaning - plating transparent electrode layer and the transparent electrode lithography graphics - corrosion - to glue to platform graphics lithography, and dry etching to stripping, annealing SiO2 deposition - window graphics lithography - SiO2 corrosion - stripping - N extremely graphic lithography to pre cleaning, coating to peel, annealing to P extremely graphic printing, coating to peel, grinding and cutting to chip, finished product testing.

Talked about in different locations on the wafer extraction parameters testing, nine points do to do not conform to the requirements of the wafer for additional processing, these cannot be directly used to make the LED wafer square piece, also won't do any sorting, sold directly to customers, which is currently on the market the LED wafer (but also have good things in your wafer, such as the party).

The LED chip manufacturing process

Actually epitaxial wafer production process is very complex, in the exhibition after the epitaxial wafer, began to LED epitaxial wafer do next electrode (P, N), and then began to use laser machine for cutting the LED epitaxial wafer (previously LED epitaxial wafer mainly use diamond cutting knife), made into a chip, in different locations in the wafer on extraction of nine points test parameters.

1 Main wavelength, intensity and voltage test, the shipment can conform to the normal standard parameters of the wafer to continue to do the next step of operation, if the test does not conform to the requirements of the wafer at 9 o 'clock, just put aside the other processing.

2 Wafer cutting chip, 100% of the visual inspection (VI/VC), the operator to use 30 multiples of the microscope magnified visual analysis.

3、Then the use of automatic sorting machine according to the different voltage, wavelength, intensity of prediction parameters for automatic selection of the chip, testing and classification.

4、The final inspection on the LED chip (VC) and labeling. Chip area in the center of the blue film, blue film on up to 5000 chip, but must ensure that each blue film on chip shall not be less than 1000, the number of the chip type, batch number, quantity, and photoelectric measurement data recorded on the label, attached to the back of the glossy paper. Blue chips will be the last item on the membranes of the testing and visual inspection standard is the same for the first time, to ensure the quality of chip neatly and qualified. So you made the LED chip (generally referred to as the party piece) on the market at present. In LED chip production process, some of the defective or damaged electrode chip, sorting out, these are the back of the crystal, this time on the blue film has some chips do not conform to the requirements of the normal shipment will naturally became edge or wool, etc.